• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    PURPOSE: A pressure sensor for measuring the pressure is provided to remove corrosion of parts exposed around circumference and destruction danger of elements. CONSTITUTION: A pressure sensor component for mounting on the insertion surface(2) of a printed circuit board(3) includes a chip carrier made of electrically insulating material and having an approximately flat chip carrier surface(4). The semiconductor chip(6) having a circuit, the integrated pressure sensor, and electrode terminals(7) which are connected by electrical means to the semiconductor chip (6), traverse the chip carrier (5) and have a surface mounted arrangement are fastened to chip carrier surface. The chip carrier (5) is filled with a free flowing filler (32) covering the semiconductor chip (6) completely.
    公开号:KR20000022326A
    申请号:KR1019980710749
    申请日:1997-06-17
    公开日:2000-04-25
    发明作者:위르겐 빈테러；알베르트 아우부르거
    申请人:칼 하인쯔 호르닝어；지멘스 악티엔게젤샤프트；
    IPC主号:
    专利说明:

    Pressure sensor element mounted on mounting surface of a printed circuit board
    The use of surface mountable semiconductor device housings in SMD devices (SMD = surface mounted design) allows for inexpensive and low location contact on user substrates. This also applies to sensor elements used for pressure measurement. In this assembly form, the element terminals are not inserted into the holes of the printed circuit board as in the insert assembly, but are placed at the terminal points on the printed circuit board and soldered there. Devices for surface assembly are smaller than for insert assembly, because the hole diameter and solder land diameter of the printed circuit board do not determine the size of the terminals. Also, holes necessary only for mounting in the printed circuit board are omitted. The holes necessary only for contact can be implemented as technically as small as possible. Since both sides of the printed circuit board can be mounted for this purpose, significant place savings and significant cost savings can be achieved by surface assembly. If the electrode terminal across the chip carrier and electrically connected to the semiconductor chip is formed in the form of a terminal leg from at least two sides of the chip carrier, the height of the electronic element is very low. The terminal legs are bent and cut into short terminal stubs.
    For the measurement of pressure, the medium to be measured must be provided to the sensor or the pressure in the medium must be transmitted to the sensor. For this purpose, the pressure sensor is arranged in an element housing with one side open, so that the sensitive chip surface of the pressure sensor can be in direct contact with the medium to be measured. In such a device, the sensitive chip sensor and other components of the pressure sensor element with one open side are exposed to harmful ambient influences, which risks corrosion of the component parts, which corrosion may destroy the device.
    The present invention comprises a chip carrier having a substantially flat chip surface, in particular an electrode terminal having an electrically insulating material, and an electrode terminal having a device across the chip carrier and electrically connected to a semiconductor chip and surface mountable, A pressure sensor element mounted on a mounting surface of a printed circuit board on which a semiconductor chip having a pressure sensor is fixed.
    1 is a schematic side view of a pressure sensor element according to an embodiment of the present invention,
    2 is a perspective view of a chip carrier of the pressure sensor element according to the embodiment.
    It is an object of the present invention to include a one-sided open housing with a chip carrier and mounted on a mounting surface of a printed circuit board so that the risk of component destruction and corrosion of components exposed to ambient influence can be reliably avoided. It is to provide a pressure sensor element for.
    This object is achieved by a pressure sensor element according to claim 1.
    According to the invention the chip carrier is filled with a flowable filler which completely covers the semiconductor chip.
    In the present invention a flowable filler is used which completely covers the sensitive semiconductor chip to protect it from ambient influences. Since the filler is fluid, it has sufficient elasticity and flexibility, thus transferring pressure to the pressure sensor without causing errors in the measurement results. Thus, two requirements for best pressure bonding and separation of the medium to be measured are met.
    The use of flowable fillers as protection against ambient influences offers the inexpensive and in-line casing possibilities of pressure sensors made from large numbers of parts. It is desirable to supply a flowable filler in an amount to achieve controlled filling properties. For this purpose, in a particularly preferred embodiment of the present invention, the side of the chip carrier lying opposite the mounting surface of the printed circuit board is formed so as to open to one side, and the side wall of the chip carrier has an anti-flow edge disposed on the inner side thereof. Have The anti-flow edge stops the capillary force of the adhesive filler, thereby preventing the filler from rising above the edge of the housing. Therefore, in the next step in the manufacture of the pressure sensor element, interference with filler and contamination or damage of the manufacturing tool can be prevented. In accordance with the present invention, the flowable filler is located inside the device in a precisely defined manner and the discharge of the filler can be reliably avoided even when the chip carrier which is open to one side is assembled upside down. Preferably the measurement sensitivity of the pressure sensor with respect to the acceleration or pressure to be measured is reduced so that in the correspondingly formed apparatus the flow stop edge keeps the effective thickness of the flowable filler as small as possible, as is known, with increasing gel thickness. It may not be adversely affected.
    The flowable filler according to the invention encloses particularly corrosive metal parts of the pressure sensor element, in particular connection wires, support carriers for semiconductor chips and the like. In a particularly preferred embodiment of the invention, the flowable filler is a gel.
    Particularly preferably the invention relates to a pressure sensor element for mounting on a mounting surface of a printed circuit board. Therefore, in this sense, it is preferable that an electrode terminal traversing the chip carrier and connected to the semiconductor chip is formed in the form of a terminal leg emerging from at least one side of the chip carrier, and the terminal leg is bent and cut into a short terminal stub. Preferred embodiments of the invention are set out in the claims subclaims.
    Particularly preferably the chip carrier is integrally made of thermoplastic material.
    Further features, advantages and preferred embodiments of the invention appear in the following description of the embodiments with reference to the accompanying drawings.
    The figure shows an embodiment of a pressure sensor element 1 according to the invention for mounting on a mounting surface 2 of a printed circuit board 3. The pressure sensor element 1 comprises a chip carrier 5 made of an electrically insulating plastic material, having an approximately flat chip carrier surface 4. On the chip carrier surface 4 a semiconductor chip 6 having an integrated pressure sensor (not shown) and electronic circuits (not shown), and electrically connected to the semiconductor chip 6 across the chip carrier 5. The electrode terminal 7 is fixed. The end 8 of the electrode terminal 7 is placed at a terminal point (not shown) on the mounting surface 2 of the printed circuit board 3 and soldered there. The integrally integrated chip carrier 5 produced by the known plastic casting method has a lower part 9 protruding relative to the mounting surface 2 and side parts 10, 10a disposed on the side of the lower part 9. ) And (11), (11a). The semiconductor chip 6 is supported on the lower portion 9. The side parts 10, 10a and 11, 11a form side walls of the pressure sensor housing. The chip carrier 5 has the outer boundaries 12, 13 of the chip carrier 5 facing the mounting surface 2 of the printed circuit board 3 in the manner shown in scale in FIG. 1. It is formed so as to have a gap with respect to the mounting surface 2 of the printed circuit board 3 which is gradually increasing from the lower edge regions 14, 15 of 5) to the center region. In particular, the outer boundaries 12, 13 of the chip carrier 5 have an inverted V- or roof shape when viewed in cross section, with the vertices of the inverted V being centrally located. Wherein the maximum spacing to the printed circuit board is from about 0.1 mm to about 0.5 mm. In addition, the electrode terminal 7 across the chip carrier 5 and connected to the semiconductor chip 6 is formed in the shape of a terminal leg exiting at least two sides of the chip carrier 5. The terminal leg is bent and cut into short terminal stubs 17. Such a device ensures the lowest height of the sensor element. In addition, the bent portion 18 of the terminal leg is completely accommodated inside the side parts 10, 11 of the chip carrier 5. This reduces the volume of the housing, reduces the size of the lead frame, and further extends the leakage path of the corrosive medium, thereby reducing mixing with the chemicals. The device also enables mechanical fixation of the lead frame or electrode terminal 7 inside the housing of the part, thereby further increasing the mechanical stability as a whole. In addition, the end portions 8 of the terminal legs protruding from the side parts 10, 11 of the chip carrier 5 have a very small inclination with respect to the mounting surface 2 of the printed circuit board 3, so that the mounting The outermost edge 19 of the end 8 of the terminal leg towards the surface 2 is spaced about 0.1 mm with respect to the auxiliary plane 20, shown by the broken line. It is ensured that the device makes contact of the element with the mounting surface 2 of the printed circuit board 3 only by the outermost end 8 of the terminal leg, which is formed so that the lower part protrudes from the printed circuit board and the housing is The deflection of the printed circuit board 3 is taken into account with the illustrated preferred housing arrangement formed in the shape of a roof as shown. In addition, problems when mounting an element on the printed circuit board 3 and when inserting the printed circuit board 3 later are avoided. Preferably the adjustment by the so-called trimming tool, which has been necessary so far at the time of mounting, is omitted. At the same time, the requirement of spacing for a given ground is considered. Mounting is more preferably performed because good adhesion of the mounting adhesive is ensured, and the tolerance of the printed circuit board 3 to warpage is compensated for, and also thermal and / or mechanical deformation is prevented, because This is because contact with the printed circuit board 3 is given only by the terminal legs.
    For electrical connection between the pressure sensor formed integrally on the semiconductor chip 6 or the electronic circuit assigned thereto and the electrode terminal 7, as shown, the bonding wire 21 is provided with a metal chip terminal point 21a on the chip. A wire contact method can be used which is fixed to and drawn out to the electrode leg to be connected. Also for this electrical connection, a so-called spider-contact method may be used in which a conductive system carrier plate or a so-called lead frame is used instead of a bonding wire.
    The pressure sensor integrated on the silicon semiconductor chip 6 is a so-called piezoresistive sensor. The piezoresistive sensor is provided with a thin silicon film fabricated on the surface of the chip according to the method of micromechanics. The silicon film is electrically coupled with a pressure dependent resistor. The resistor is likewise formed in the silicon substrate and connected to the bridge circuit in a known manner. Similarly, a circuit allocated to the sensor is integrated in the semiconductor chip 6. The circuit is used for signal processing (amplification and correction) and compensation of the sensor. Compared to other structural shapes, the semiconductor pressure sensor on which the present invention is based is suitable for pressure measurements such as brake pressure, tire pressure, combustion chamber pressure, etc., in applications that should have the lowest height, such as in the automotive field. In addition to semiconductor pressure sensors operating on the principle of piezoresistive pressure measurement, pressure sensors operating on the capacitive measurement principle may also be used.
    In the embodiment shown in FIG. 1, the chip carrier 5 is formed such that its side 22 opposite to the mounting surface 2 of the printed circuit board 3 opens to one side, and opens the opening 23. By having support means 26 for clearance-free mechanical positive engagement with the securing means of the terminal parts (not shown) which can rest on the chip carrier 5 at the upper edge regions 24, 25 which limit When the terminal component is mounted on the chip carrier 5, the fixing means and the supporting means 26 are alternately coupled. For this purpose, the support means 26 of the chip carrier 5 has a surface 29 which supports the fixing means of the terminal component on its outer circumference. As shown, it may be formed in the form of a groove 30 formed in the edge region of the chip carrier 5. A spring formed on the outer circumference of the terminal component is at least partially inserted into the groove 30.
    The chip carrier 5 is filled with a flowable filler 32, which completely covers the semiconductor chip 6. The filler is in particular a gel which delivers pressure to the semiconductor pressure sensor with little delay and no error. The gel, on the one hand, is sensitive to the sensitive pressure sensor chip 6 and other, in particular metal parts of the electronic device, in particular the bonding wire 21, the terminal leg 7 or the lead frame, from ambient influences and from contact with the medium 33 to be measured. Used to protect. Thus, contamination of components by ions or other harmful components of the medium 33, or the risk of corrosion due to ambient influences or the medium 33 is prevented. In addition, by using the gel 32 as a filler, the useless space between the sensor element and the terminal component is kept as small as possible, thereby avoiding an error or a time delay in measuring the pressure. In order to further separate the medium to be measured from the semiconductor chip 6 or the electronic component parts susceptible to corrosion, the side of the terminal part facing the chip carrier 5 is closed by the elastic membrane. The membrane can deliver the pressure of the medium from the sensor without errors or time delays and prevents the risk of contamination of the part by ions or other harmful components of the medium.
    The sidewalls 24, 25 of the chip carrier 5 with one side open may be provided with a flow preventing edge 36 disposed on the inner surface. In this case, the inner surface of the chip carrier 5 is filled with the gel 32 only up to the flow preventing edge 36. The anti-flow edge 36 can stop the capillary force of the adhesive gel 32, thereby preventing the gel 32 from rising above the housing edge by capillary force.
    权利要求:
    Claims (12)
    [1" claim-type="Currently amended] A chip carrier 5 having an approximately flat chip surface 4, and an electrode terminal 7 having a device that is electrically connectable to the semiconductor chip 6 and that is surface mountable across the chip carrier 5; In the pressure sensor element (1) mounted on the mounting surface (2) of the printed circuit board (3), on which the semiconductor chip (6) with a pressure sensor is fixed on the chip carrier surface (4), the chip carrier (5) Pressure sensor element, characterized in that is filled with a flowable filler (32) which completely covers the semiconductor chip (6).
    [2" claim-type="Currently amended] The chip carrier (5) according to claim 1, wherein the chip carrier (5) is formed such that its side (22) opposite to the mounting surface (2) of the printed circuit board (3) is open to one side and the side wall of the chip carrier (5) is internal. Pressure sensor element, characterized in that it has a flow stop edge (36) disposed on the surface.
    [3" claim-type="Currently amended] The pressure according to claim 1 or 2, characterized in that the flowable filler (32) surrounds particularly corrosive metal parts of the pressure sensor element (1), in particular connection wires, support carriers for the semiconductor chip (6), and the like. Sensor element.
    [4" claim-type="Currently amended] 4. Pressure sensor element according to any one of the preceding claims, characterized in that the flowable filler (32) is a gel.
    [5" claim-type="Currently amended] 5. The terminal leg according to claim 1, wherein an electrode terminal 7 across the chip carrier 5 and electrically connected to the semiconductor chip 6 emerges from at least one side of the chip carrier 5. And the terminal leg is bent and cut by a short terminal stub (17).
    [6" claim-type="Currently amended] 6. The lower part 9 and the lower part according to claim 1, wherein the chip carrier 5 made of a conductive material and in particular integrally protrudes from the mounting surface 2 of the printed circuit board 3. 7. A pressure sensor element comprising side parts (10, 10a, 11, 11a) disposed on both sides of (9).
    [7" claim-type="Currently amended] The pressure sensor element according to any one of claims 1 to 6, wherein the bent portion of the terminal leg is accommodated inside the side components (10, 10a, 11, 11a) of the chip carrier (5).
    [8" claim-type="Currently amended] 8. The end of the terminal leg protruding from the side components 10, 10a, 11, 11a of the chip carrier 5 is very small relative to the mounting surface 2 of the printed circuit board 3. Pressure sensor element characterized by having a slope.
    [9" claim-type="Currently amended] 9. The outer interface 12, 13 of the chip carrier 5 facing the mounting surface 2 of the printed circuit board 3 is viewed in cross section of the chip carrier 5. Pressure sensor element characterized in that it has an inverted V shape.
    [10" claim-type="Currently amended] 10. The maximum distance between the outer interface 12, 13 of the chip carrier 5 facing the mounting surface 2 and the printed circuit board 3, according to claim 1. Pressure sensor element characterized in that.
    [11" claim-type="Currently amended] The pressure sensor element as claimed in claim 1, wherein the chip carrier is made of thermoplastic material.
    [12" claim-type="Currently amended] The pressure sensor element according to any one of claims 1 to 11, wherein the pressure sensor is a piezoresistive pressure sensor or a capacitive pressure sensor.
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    同族专利:
    公开号 | 公开日
    WO1998000690A1|1998-01-08|
    DE19626086A1|1998-01-02|
    EP0907880B1|2002-03-27|
    JP2000513446A|2000-10-10|
    JP3546059B2|2004-07-21|
    US6047604A|2000-04-11|
    EP0907880A1|1999-04-14|
    CN1217059A|1999-05-19|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1996-06-28|Priority to DE1996126086
    1996-06-28|Priority to DE19626086.8
    1997-06-17|Application filed by 칼 하인쯔 호르닝어, 지멘스 악티엔게젤샤프트
    2000-04-25|Publication of KR20000022326A
    优先权:
    申请号 | 申请日 | 专利标题
    DE1996126086|DE19626086A1|1996-06-28|1996-06-28|Pressure sensor component that can be mounted on the assembly surface of a printed circuit board|
    DE19626086.8|1996-06-28|
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